Analytical buckling temperature prediction of FG piezoelectric sandwich plates with lightweight core

Buckling temperature prediction of a functionally graded piezoelectric (FGP) sandwich plate with lightweight core is studied in the present work. The composite made three layers. upper and lower layers are two different materials so that electrical mechanical properties smoothly varied through thickness based on power law distribution. Whereas, considered as hexagonal honeycomb structure or porous structure. contains internal pores porosity distributions. According to modified four-unknown shear deformation theory, displacement field described. smart advanced subjected thermal humid loadings well external electric voltage. may be uniform, linear non-linear thickness. stability equations constructed from principle virtual work proposed theory. obtained results will validated by introducing some comparison examples. Finally, influences parameters like side-to-thickness ratio, aspect type, thickness, index, moisture concentration, applied voltage boundary conditions buckling change plates discussed. It found greater than core. Moreover, increasing stiffness decreases leading reduction temperature.